Publication:
Redefining 2-Level Semi-Damascene Interconnect Technology: Benchmarking three different Fully Self-aligned Via options
| dc.contributor.author | Marti, Giulio | |
| dc.contributor.author | Delie, Gilles | |
| dc.contributor.author | Murdoch, Gayle | |
| dc.contributor.author | Gupta, Anshul | |
| dc.contributor.author | Kundu, Souvik | |
| dc.contributor.author | Decoster, Stefan | |
| dc.contributor.author | Varela Pedreira, Olalla | |
| dc.contributor.author | Lesniewska, Alicja | |
| dc.contributor.author | Hermans, Yannick | |
| dc.contributor.author | Kenens, Bart | |
| dc.contributor.author | Ulu Okudur, Fulya | |
| dc.contributor.author | Park, Seongho | |
| dc.contributor.author | Tokei, Zsolt | |
| dc.contributor.imecauthor | Marti, Giulio | |
| dc.contributor.imecauthor | Murdoch, Gayle | |
| dc.contributor.imecauthor | Gupta, Anshul | |
| dc.contributor.imecauthor | Kundu, Souvik | |
| dc.contributor.imecauthor | Decoster, Stefan | |
| dc.contributor.imecauthor | Kenens, Bart | |
| dc.contributor.imecauthor | Park, Seongho | |
| dc.contributor.imecauthor | Tokei, Zsolt | |
| dc.contributor.imecauthor | Delie, Gilles | |
| dc.contributor.imecauthor | Varela Pedreira, Olalla | |
| dc.contributor.imecauthor | Lesniewska, Alicja | |
| dc.contributor.imecauthor | Hermans, Yannick | |
| dc.contributor.imecauthor | Ulu Okudur, Fulya | |
| dc.contributor.orcidimec | Murdoch, Gayle::0000-0002-6833-220X | |
| dc.contributor.orcidimec | Gupta, Anshul::0000-0003-4276-5397 | |
| dc.contributor.orcidimec | Kundu, Souvik::0000-0001-5815-8765 | |
| dc.contributor.orcidimec | Decoster, Stefan::0000-0003-1162-9288 | |
| dc.contributor.orcidimec | Kenens, Bart::0000-0003-2329-5449 | |
| dc.contributor.orcidimec | Park, Seongho::0000-0002-1058-9424 | |
| dc.contributor.orcidimec | Tokei, Zsolt::0000-0003-3545-3424 | |
| dc.contributor.orcidimec | Delie, Gilles::0000-0002-5646-3261 | |
| dc.contributor.orcidimec | Varela Pedreira, Olalla::0000-0002-2987-1972 | |
| dc.contributor.orcidimec | Lesniewska, Alicja::0000-0003-3863-065X | |
| dc.contributor.orcidimec | Hermans, Yannick::0000-0002-6973-0795 | |
| dc.contributor.orcidimec | Ulu Okudur, Fulya::0000-0002-8046-7748 | |
| dc.date.accessioned | 2025-06-05T13:12:11Z | |
| dc.date.available | 2025-03-06T20:46:38Z | |
| dc.date.available | 2025-06-05T13:12:11Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/IITC61274.2024.10732570 | |
| dc.identifier.eisbn | 979-8-3503-8517-5 | |
| dc.identifier.isbn | 979-8-3503-8518-2 | |
| dc.identifier.issn | 2380-632X | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/45341 | |
| dc.publisher | IEEE | |
| dc.source.conference | 2024 International Interconnect Technology Conference | |
| dc.source.conferencedate | JUN 03-06, 2024 | |
| dc.source.conferencelocation | San Jose | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 3 | |
| dc.title | Redefining 2-Level Semi-Damascene Interconnect Technology: Benchmarking three different Fully Self-aligned Via options | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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