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Grain growth in electroplated copper
Publication:
Grain growth in electroplated copper
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Date
2001
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Brongersma, Sywert
;
Kerr, Emma
;
Vervoort, Iwan
;
Maex, Karen
Journal
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1937
since deposited on 2021-10-14
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last week
Acq. date: 2025-12-10
Citations
Metrics
Views
1937
since deposited on 2021-10-14
2
last month
2
last week
Acq. date: 2025-12-10
Citations