Publication:
Grain growth in electroplated copper
Date
| dc.contributor.author | Brongersma, Sywert | |
| dc.contributor.author | Kerr, Emma | |
| dc.contributor.author | Vervoort, Iwan | |
| dc.contributor.author | Maex, Karen | |
| dc.contributor.imecauthor | Brongersma, Sywert | |
| dc.contributor.imecauthor | Maex, Karen | |
| dc.contributor.orcidimec | Brongersma, Sywert::0000-0002-1755-3897 | |
| dc.date.accessioned | 2021-10-14T16:39:07Z | |
| dc.date.available | 2021-10-14T16:39:07Z | |
| dc.date.issued | 2001 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/5099 | |
| dc.source.conference | MRS Spring Meeting. Symposium L: Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics; April | |
| dc.source.conferencelocation | ||
| dc.title | Grain growth in electroplated copper | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |