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Thermal conductivity of underlayers for EUV lithography and its effect on sensitivity of metal oxide resist

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dc.contributor.authorFallica, Roberto
dc.contributor.authorDe Simone, Danilo
dc.contributor.authorHopkins, Patrick E.
dc.contributor.authorJones, Andrew
dc.contributor.authorGaskinsc, John
dc.contributor.imecauthorFallica, Roberto
dc.contributor.imecauthorDe Simone, Danilo
dc.contributor.orcidimecFallica, Roberto::0000-0003-4523-9624
dc.contributor.orcidimecDe Simone, Danilo::0000-0003-3927-5207
dc.date.accessioned2025-07-31T03:59:32Z
dc.date.available2025-07-31T03:59:32Z
dc.date.issued2025
dc.description.wosFundingTextThis work has been enabled in part by the NanoIC pilot line. The acquisition and operation are jointly funded by the Chips Joint Undertaking, through the European Union's Digital Europe (101183266) and Horizon Europe programs (101183277), as well as by the participating states Belgium (Flanders), France, Germany, Finland, Ireland and Romania (www.nanoic-project.eu). Views and opinions expressed are however those of the authors only and do not necessarily reflect those of the European Union or Chips Joint Undertaking. Neither the European Union nor the granting authority can be held responsible for them.
dc.identifier.doi10.1117/12.3051713
dc.identifier.eisbn978-1-5106-8635-9
dc.identifier.isbn978-1-5106-8634-2
dc.identifier.issn0277-786X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45977
dc.publisherSPIE-INT SOC OPTICAL ENGINEERING
dc.source.conference2025 Conference on Optical and EUV Nanolithography
dc.source.conferencedateFEB 24-27, 2025
dc.source.conferencelocationSan Jose
dc.source.numberofpages3
dc.source.volume13424
dc.title

Thermal conductivity of underlayers for EUV lithography and its effect on sensitivity of metal oxide resist

dc.typeProceedings paper
dspace.entity.typePublication
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