Alternative photoresist removal process to minimize damage of low-k material induced by ash plasma

dc.contributor.author	Le, Quoc Toan
dc.contributor.author	Keldermans, Johan
dc.contributor.author	Chiodarelli, Nicolo
dc.contributor.author	Kesters, Els
dc.contributor.author	Lux, Marcel
dc.contributor.author	Claes, Martine
dc.contributor.author	Vereecke, Guy
dc.contributor.imecauthor	Le, Quoc Toan
dc.contributor.imecauthor	Kesters, Els
dc.contributor.imecauthor	Lux, Marcel
dc.contributor.imecauthor	Claes, Martine
dc.contributor.imecauthor	Vereecke, Guy
dc.contributor.orcidimec	Le, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimec	Vereecke, Guy::0000-0001-9058-9338
dc.date.accessioned	2021-10-16T17:21:33Z
dc.date.available	2021-10-16T17:21:33Z
dc.date.issued	2007-11
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/12454
dc.source.beginpage	37
dc.source.conference	International Symposium on Dry Process
dc.source.conferencedate	13/11/2007
dc.source.conferencelocation	Tokyo Japan
dc.source.endpage	38
dc.title	Alternative photoresist removal process to minimize damage of low-k material induced by ash plasma
dc.type	Proceedings paper
dspace.entity.type	Publication
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