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Impact of material/process interactions on the properties of a porous CVD-O3 low-k dielectric film
Publication:
Impact of material/process interactions on the properties of a porous CVD-O3 low-k dielectric film
Date
2002
Journal article
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Travaly, Youssef
;
Eyckens, Brenda
;
Carbonell, Laure
;
Rothschild, Aude
;
Le, Quoc Toan
;
Brongersma, Sywert
;
Ciofi, Ivan
;
Struyf, Herbert
;
Furukawa, Yukiko
;
Stucchi, Michele
;
Schaekers, Marc
;
Bender, Hugo
;
Rosseel, Erik
;
Vanhaelemeersch, Serge
;
Maex, Karen
;
Gaillard, F.
;
Van Autryve, Luc
;
Rabinzohn, P.
Journal
Microelectronic Engineering
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1960
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations
Metrics
Views
1960
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations