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Comparison of techniques to characterise the density, porosity and elastic modulus of porous low-K SiO2 xerogel films
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Comparison of techniques to characterise the density, porosity and elastic modulus of porous low-K SiO2 xerogel films
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Date
2002
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Murray, C.
;
Flannery, C.
;
Streiter, I.
;
Schulz, S. E.
;
Baklanov, Mikhaïl
;
Mogilnikov, K. P.
;
Himcinschi, C.
;
Friedrich, M.
;
Zahn, D. R. T.
;
Gessner, T.
Journal
Microelectronic Engineering
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1962
since deposited on 2021-10-14
3
last month
Acq. date: 2025-12-10
Citations
Metrics
Views
1962
since deposited on 2021-10-14
3
last month
Acq. date: 2025-12-10
Citations