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Comparison of techniques to characterise the density, porosity and elastic modulus of porous low-K SiO2 xerogel films

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dc.contributor.authorMurray, C.
dc.contributor.authorFlannery, C.
dc.contributor.authorStreiter, I.
dc.contributor.authorSchulz, S. E.
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorMogilnikov, K. P.
dc.contributor.authorHimcinschi, C.
dc.contributor.authorFriedrich, M.
dc.contributor.authorZahn, D. R. T.
dc.contributor.authorGessner, T.
dc.date.accessioned2021-10-14T22:29:51Z
dc.date.available2021-10-14T22:29:51Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6632
dc.source.beginpage133
dc.source.endpage141
dc.source.issue1_2
dc.source.journalMicroelectronic Engineering
dc.source.volume60
dc.title

Comparison of techniques to characterise the density, porosity and elastic modulus of porous low-K SiO2 xerogel films

dc.typeJournal article
dspace.entity.typePublication
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