Publication:

Integration of Cu and low-K dielectrics: effect of hard mask and dry etch on electrical performance of damascene structures

Date

2001
Journal article
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dc.contributor.authorDonaton, R. A.
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorMaenhoudt, Mireille
dc.contributor.authorPollentier, Ivan
dc.contributor.authorStruyf, Herbert
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorVos, I.
dc.contributor.authorMeuris, Marc
dc.contributor.authorFyen, Wim
dc.contributor.authorBeyer, Gerald
dc.contributor.authorTokei, Zsolt
dc.contributor.authorStucchi, Michele
dc.contributor.authorVervoort, Iwan
dc.contributor.authorDe Roest, David
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorPollentier, Ivan
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorDe Roest, David
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecPollentier, Ivan::0000-0002-4266-6500
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.date.accessioned2021-10-14T16:52:23Z
dc.date.available2021-10-14T16:52:23Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5261
dc.source.beginpage277
dc.source.endpage283
dc.source.issue1_4
dc.source.journalMicroelectronic Engineering
dc.source.volume55
dc.title

Integration of Cu and low-K dielectrics: effect of hard mask and dry etch on electrical performance of damascene structures

dc.typeJournal article
dspace.entity.typePublication
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