Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Articles
Performance and reliability impact of copper plasticity in backside TSV-last fabrication process
Publication:
Performance and reliability impact of copper plasticity in backside TSV-last fabrication process
Copy permalink
Date
2016
Journal article
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
31837.pdf
2.19 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Karmarkar, Aditya P.
;
Guo, Wei
;
Xu, Xiaopeng
;
Van der Plas, Geert
;
Van Huylenbroeck, Stefaan
;
Gonzalez, Mario
;
Absil, Philippe
;
El Sayed, Karim
;
Beyne, Eric
Journal
IEEE Transactions on Device and Materials Reliability
Abstract
Description
Metrics
Views
1923
since deposited on 2021-10-23
Acq. date: 2025-12-15
Citations
Metrics
Views
1923
since deposited on 2021-10-23
Acq. date: 2025-12-15
Citations