Publication:

Performance and reliability impact of copper plasticity in backside TSV-last fabrication process

Date

2016
Journal article
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dc.contributor.authorKarmarkar, Aditya P.
dc.contributor.authorGuo, Wei
dc.contributor.authorXu, Xiaopeng
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorGonzalez, Mario
dc.contributor.authorAbsil, Philippe
dc.contributor.authorEl Sayed, Karim
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorGuo, Wei
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorAbsil, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-23T11:40:54Z
dc.date.available2021-10-23T11:40:54Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.issn1530-4388
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26809
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7527618
dc.source.beginpage402
dc.source.endpage412
dc.source.issue3
dc.source.journalIEEE Transactions on Device and Materials Reliability
dc.source.volume16
dc.title

Performance and reliability impact of copper plasticity in backside TSV-last fabrication process

dc.typeJournal article
dspace.entity.typePublication
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