Publication:

Electromigration scaling limits of copper interconnects

Date

2019
Proceedings Paper
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dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorCiofi, Ivan
dc.contributor.authorTokei, Zsolt
dc.contributor.authorCroes, Kristof
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-27T22:04:19Z
dc.date.available2021-10-27T22:04:19Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34329
dc.source.beginpage407
dc.source.conferenceExtended Abstracts of the 2019 International Conference on Solid State Devices and Materials - SSDM
dc.source.conferencedate2/09/2019
dc.source.conferencelocationNagoya Japan
dc.source.endpage408
dc.title

Electromigration scaling limits of copper interconnects

dc.typeProceedings paper
dspace.entity.typePublication
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