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Minimizing within die non uniformity in CMP by optimising polishing parameters and consumables

Date

1997
Proceedings Paper
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dc.contributor.authorGrillaert, Joost
dc.contributor.authorMeynen, Herman
dc.contributor.authorWaeterloos, Joost
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorVan den hove, Luc
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorVan den hove, Luc
dc.date.accessioned2021-09-30T08:20:39Z
dc.date.available2021-09-30T08:20:39Z
dc.date.embargo9999-12-31
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1902
dc.source.beginpage525
dc.source.conferenceAdvanced Metallization and Interconnect Systems for ULSI Applications in 1996
dc.source.conferencedate1/10/1996
dc.source.conferencelocationBoston, MA USA
dc.source.endpage530
dc.title

Minimizing within die non uniformity in CMP by optimising polishing parameters and consumables

dc.typeProceedings paper
dspace.entity.typePublication
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