Publication:

Wafer bevel protection during deep reactive ion etching

Date

2011
Journal article
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dc.contributor.authorCharavel, Remy
dc.contributor.authorRoig, Jaime
dc.contributor.authorAltamirano Sanchez, Efrain
dc.contributor.authorVan Aelst, Joke
dc.contributor.authorDevriendt, Katia
dc.contributor.authorVan Wichelen, Koen
dc.contributor.authorGassot, Pierre
dc.contributor.authorCoppens, Peter
dc.contributor.authorDe Backer, Eddy
dc.contributor.imecauthorAltamirano Sanchez, Efrain
dc.contributor.imecauthorVan Aelst, Joke
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.date.accessioned2021-10-19T12:43:37Z
dc.date.available2021-10-19T12:43:37Z
dc.date.embargo9999-12-31
dc.date.issued2011
dc.identifier.issn0894-6507
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18652
dc.source.beginpage358
dc.source.endpage365
dc.source.issue2
dc.source.journalIEEE Transactions on Semiconductor Manufacturing
dc.source.volume24
dc.title

Wafer bevel protection during deep reactive ion etching

dc.typeJournal article
dspace.entity.typePublication
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