Publication:

Low temperature backside damascene processing on temporary carrier wafer targeting 7 mu m and 5 mu m pitch microbumps for N equal and greater than 2 die to wafer TCB stacking

Date

2022
Proceedings Paper
https://doi.org/10.1109/ECTC51906.2022.00179
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dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorBeyne, Eric
dc.contributor.authorBeyer, Gerald
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorCherman, Vladimir
dc.contributor.authorDe Preter, Inge
dc.contributor.authorGerets, Carine
dc.contributor.authorShafahian, Ehsan
dc.contributor.authorKennes, Koen
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorCochet, Tom
dc.contributor.authorWebers, Tomas
dc.contributor.authorTobback, Bert
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorLa Tulipe, Douglas Charles
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorMiller, Andy
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorShafahian, Ehsan
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorCochet, Tom
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorTobback, Bert
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorLa Tulipe, Douglas Charles
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorMiller, Andy
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecCherman, Vladimir::0000-0002-8068-9236
dc.contributor.orcidimecShafahian, Ehsan::0000-0001-6125-5793
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.date.accessioned2023-02-23T12:33:42Z
dc.date.available2022-09-17T02:52:08Z
dc.date.available2023-02-23T12:33:42Z
dc.date.issued2022
dc.identifier.doi10.1109/ECTC51906.2022.00179
dc.identifier.eisbn978-1-6654-7943-1
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40443
dc.publisherIEEE
dc.source.beginpage1108
dc.source.conference72nd IEEE Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 31-JUN 01, 2022
dc.source.conferencelocationSan Diego
dc.source.endpage1113
dc.source.journalna
dc.source.numberofpages6
dc.title

Low temperature backside damascene processing on temporary carrier wafer targeting 7 mu m and 5 mu m pitch microbumps for N equal and greater than 2 die to wafer TCB stacking

dc.typeProceedings paper
dspace.entity.typePublication
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