Publication:

Novel process to pattern selectively dual dielectric capping layers using soft-mask only

Date

2008
Proceedings Paper
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dc.contributor.authorSchram, Tom
dc.contributor.authorKubicek, Stefan
dc.contributor.authorRohr, Erika
dc.contributor.authorBrus, Stephan
dc.contributor.authorVrancken, Christa
dc.contributor.authorChang, Shou-Zen
dc.contributor.authorChang, V.S.
dc.contributor.authorMitsuhashi, Riichiru
dc.contributor.authorOkuno, Yasutoshi
dc.contributor.authorAkheyar, Amal
dc.contributor.authorCho, Hag-Ju
dc.contributor.authorHooker, J.C.
dc.contributor.authorParaschiv, Vasile
dc.contributor.authorVos, Rita
dc.contributor.authorSebaai, Farid
dc.contributor.authorErcken, Monique
dc.contributor.authorKelkar, Prasad
dc.contributor.authorDelabie, Annelies
dc.contributor.authorAdelmann, Christoph
dc.contributor.authorWitters, Thomas
dc.contributor.imecauthorSchram, Tom
dc.contributor.imecauthorKubicek, Stefan
dc.contributor.imecauthorBrus, Stephan
dc.contributor.imecauthorVrancken, Christa
dc.contributor.imecauthorParaschiv, Vasile
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorSebaai, Farid
dc.contributor.imecauthorErcken, Monique
dc.contributor.imecauthorDelabie, Annelies
dc.contributor.imecauthorAdelmann, Christoph
dc.contributor.imecauthorWitters, Thomas
dc.contributor.imecauthorRagnarsson, Lars-Ake
dc.contributor.imecauthorKerner, Christoph
dc.contributor.imecauthorChiarella, Thomas
dc.contributor.imecauthorDe Meyer, Kristin
dc.contributor.imecauthorLauwers, Anne
dc.contributor.imecauthorAbsil, Philippe
dc.contributor.imecauthorBiesemans, Serge
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.contributor.orcidimecRagnarsson, Lars-Ake::0000-0003-1057-8140
dc.contributor.orcidimecChiarella, Thomas::0000-0002-6155-9030
dc.date.accessioned2021-10-17T10:34:38Z
dc.date.available2021-10-17T10:34:38Z
dc.date.embargo9999-12-31
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14441
dc.source.beginpage44
dc.source.conferenceSymposium on VLSI Technology Digest of Technical Papers
dc.source.conferencedate17/06/2008
dc.source.conferencelocationHonolulu, HI USA
dc.source.endpage45
dc.title

Novel process to pattern selectively dual dielectric capping layers using soft-mask only

dc.typeProceedings paper
dspace.entity.typePublication
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