Publication:

Magnetic tunnel junctions etch and encapsulation process optimization for high-density STT-MRAM applications

Date

2016
Meeting abstract
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dc.contributor.authorSouriau, Laurent
dc.contributor.authorRadisic, Dunja
dc.contributor.authorKundu, Shreya
dc.contributor.authorParaschiv, Vasile
dc.contributor.authorYamashita, Fumiko
dc.contributor.authorFujimoto, Kiwamu
dc.contributor.authorTahara, Shigeru
dc.contributor.authorMaeda, K.
dc.contributor.authorKim, Woojin
dc.contributor.authorRao, Siddharth
dc.contributor.authorDonadio, Gabriele Luca
dc.contributor.authorCrotti, Davide
dc.contributor.authorTsvetanova, Diana
dc.contributor.authorSwerts, Johan
dc.contributor.authorMertens, Sofie
dc.contributor.authorLin, Tsann
dc.contributor.authorCouet, Sebastien
dc.contributor.authorPiumi, Daniele
dc.contributor.authorKar, Gouri Sankar
dc.contributor.authorFurnemont, Arnaud
dc.contributor.imecauthorSouriau, Laurent
dc.contributor.imecauthorRadisic, Dunja
dc.contributor.imecauthorKundu, Shreya
dc.contributor.imecauthorParaschiv, Vasile
dc.contributor.imecauthorKim, Woojin
dc.contributor.imecauthorRao, Siddharth
dc.contributor.imecauthorDonadio, Gabriele Luca
dc.contributor.imecauthorCrotti, Davide
dc.contributor.imecauthorTsvetanova, Diana
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorMertens, Sofie
dc.contributor.imecauthorCouet, Sebastien
dc.contributor.imecauthorPiumi, Daniele
dc.contributor.imecauthorKar, Gouri Sankar
dc.contributor.imecauthorFurnemont, Arnaud
dc.contributor.orcidimecSouriau, Laurent::0000-0002-5138-5938
dc.contributor.orcidimecRao, Siddharth::0000-0001-6161-3052
dc.contributor.orcidimecMertens, Sofie::0000-0002-1482-6730
dc.contributor.orcidimecCouet, Sebastien::0000-0001-6436-9593
dc.contributor.orcidimecFurnemont, Arnaud::0000-0002-6378-1030
dc.date.accessioned2021-10-23T15:07:41Z
dc.date.available2021-10-23T15:07:41Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27338
dc.source.beginpagePS-ThP33
dc.source.conferenceAVS 63rd International Symposium and Exhibition
dc.source.conferencedate6/11/2016
dc.source.conferencelocationNashville, TN USA
dc.title

Magnetic tunnel junctions etch and encapsulation process optimization for high-density STT-MRAM applications

dc.typeMeeting abstract
dspace.entity.typePublication
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