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Buried Interconnects for Sub-5 nm SRAM Design

 
dc.contributor.authorMathur, R.
dc.contributor.authorBhargava, M.
dc.contributor.authorCline, B.
dc.contributor.authorSalahuddin, Shairfe Muhammad
dc.contributor.authorGupta, Anshul
dc.contributor.authorSchuddinck, Pieter
dc.contributor.authorRyckaert, Julien
dc.contributor.authorKulkarni, J.P.
dc.contributor.imecauthorSalahuddin, Shairfe Muhammad
dc.contributor.imecauthorGupta, Anshul
dc.contributor.imecauthorSchuddinck, Pieter
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.orcidextMathur, R.::0000-0002-8064-5612
dc.contributor.orcidimecSalahuddin, S.::0000-0002-6483-8430
dc.contributor.orcidimecSalahuddin, Shairfe Muhammad::0000-0002-6483-8430
dc.contributor.orcidimecSchuddinck, Pieter::0000-0003-1893-3135
dc.date.accessioned2023-06-20T13:38:04Z
dc.date.available2023-06-20T10:36:07Z
dc.date.available2023-06-20T13:38:04Z
dc.date.issued2022
dc.description.wosFundingTextThe 5-nm technology files and simulation models were provided by imec. Tool support for extraction was provided by Synopsys.
dc.identifier.doi10.1109/TED.2022.3143078
dc.identifier.issn0018-9383
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41927
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage1041
dc.source.endpage1047
dc.source.issue3
dc.source.journalIEEE TRANSACTIONS ON ELECTRON DEVICES
dc.source.numberofpages7
dc.source.volume69
dc.title

Buried Interconnects for Sub-5 nm SRAM Design

dc.typeJournal article
dspace.entity.typePublication
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