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A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP
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A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP
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Date
2017
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34919.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Phommahaxay, Alain
;
Nakamura, Atsushi
;
Potoms, Goedele
;
Bertheau, Julien
;
Bex, Pieter
;
Duval, Fabrice
;
Podpod, Arnita
;
Verbinnen, Greet
;
Kamochi, Yoshitaka
;
Sawano, Mitsuru
;
Beyer, Gerald
;
Sleeckx, Erik
;
Beyne, Eric
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2005
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Views
2005
since deposited on 2021-10-24
3
last month
1
last week
Acq. date: 2025-12-12
Citations