Publication:

Stress build-up during the Ni-silicidation in and around narrow silicide lines

Date

2000
Presentation
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dc.contributor.authorSteegen, An
dc.contributor.authorLauwers, Anne
dc.contributor.authorChamirian, Oxana
dc.contributor.authorBender, Hugo
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorde Potter de ten Broeck, Muriel
dc.contributor.authorDe Tavernier, C.
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorLauwers, Anne
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorde Potter de ten Broeck, Muriel
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-14T13:50:31Z
dc.date.available2021-10-14T13:50:31Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4769
dc.source.conferenceMRS Spring Meeting 2000. Symposium C: Gate Stack and Silicide Issues in Silicon Processing
dc.source.conferencedate24/04/2000
dc.source.conferencelocationSan Francisco, CA USA
dc.title

Stress build-up during the Ni-silicidation in and around narrow silicide lines

dc.typeOral presentation
dspace.entity.typePublication
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