Publication:

30nm half-pitch metal patterning using MotifTM CD shrink technique and double patterning

Date

2008
Proceedings Paper
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dc.contributor.authorVersluijs, Janko
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorGoossens, Danny
dc.contributor.authorOp de Beeck, Maaike
dc.contributor.authorVandeweyer, Tom
dc.contributor.authorWiaux, Vincent
dc.contributor.authorStruyf, Herbert
dc.contributor.authorMaenhoudt, Mireille
dc.contributor.authorBrouri, Mohand
dc.contributor.authorVertommen, Johan
dc.contributor.authorKim, Ji Soo
dc.contributor.authorZhu, Helen
dc.contributor.authorSadjadi, Reza
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorGoossens, Danny
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.imecauthorVandeweyer, Tom
dc.contributor.imecauthorWiaux, Vincent
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.date.accessioned2021-10-17T12:34:25Z
dc.date.available2021-10-17T12:34:25Z
dc.date.embargo9999-12-31
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14755
dc.source.beginpage69242C
dc.source.conferenceOptical Microlithography XXI
dc.source.conferencedate24/02/2008
dc.source.conferencelocationSan Jose, CA USA
dc.title

30nm half-pitch metal patterning using MotifTM CD shrink technique and double patterning

dc.typeProceedings paper
dspace.entity.typePublication
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