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Miniaturization using 3-D stack structure for SIP applications
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Miniaturization using 3-D stack structure for SIP applications
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Date
2003
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Stoukatch, Serguei
;
Ho, Meng
;
Vaesen, Kristof
;
Webers, Tomas
;
Carchon, Geert
;
De Raedt, Walter
;
Beyne, Eric
;
De Baets, Johan
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1915
since deposited on 2021-10-15
1
last month
Acq. date: 2025-12-09
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Metrics
Views
1915
since deposited on 2021-10-15
1
last month
Acq. date: 2025-12-09
Citations