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Miniaturization using 3-D stack structure for SIP applications

Date

2003
Proceedings Paper
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dc.contributor.authorStoukatch, Serguei
dc.contributor.authorHo, Meng
dc.contributor.authorVaesen, Kristof
dc.contributor.authorWebers, Tomas
dc.contributor.authorCarchon, Geert
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Baets, Johan
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Baets, Johan
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-15T06:51:53Z
dc.date.available2021-10-15T06:51:53Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8189
dc.source.conferenceProc. SMTA (Surface Mount Technology Association) International Conference
dc.source.conferencedate21/09/2003
dc.source.conferencelocationChicago, IL USA
dc.title

Miniaturization using 3-D stack structure for SIP applications

dc.typeProceedings paper
dspace.entity.typePublication
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