Publication:

A million wafer, virtual fabrication approach to determine process capability requirements for an industry-standard 5nm BEOL two-level metal flow

Date

2016
Proceedings Paper
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dc.contributor.authorClark, William
dc.contributor.authorJuncker, Aurelie
dc.contributor.authorPaladugu, E.
dc.contributor.authorFried, David
dc.contributor.authorWilson, Chris
dc.contributor.authorPourtois, Geoffrey
dc.contributor.authorGallagher, Emily
dc.contributor.authorde Jamblinne de Meux, Albert
dc.contributor.authorPiumi, Daniele
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.authorMocuta, Dan
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorPourtois, Geoffrey
dc.contributor.imecauthorGallagher, Emily
dc.contributor.imecauthorPiumi, Daniele
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecPourtois, Geoffrey::0000-0003-2597-8534
dc.contributor.orcidimecGallagher, Emily::0000-0002-2927-8298
dc.date.accessioned2021-10-23T10:20:26Z
dc.date.available2021-10-23T10:20:26Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26462
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7605144/
dc.source.beginpage43
dc.source.conferenceInternational Conference on Simulation of Semiconductor Processes and Devices - SISPAD
dc.source.conferencedate6/09/2016
dc.source.conferencelocationNuremberg Germany
dc.source.endpage46
dc.title

A million wafer, virtual fabrication approach to determine process capability requirements for an industry-standard 5nm BEOL two-level metal flow

dc.typeProceedings paper
dspace.entity.typePublication
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