Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Presentations
ESD evaluation of 3D SIC technology using TSV
Publication:
ESD evaluation of 3D SIC technology using TSV
Copy permalink
Date
2010
Presentation
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
19979.pdf
319.67 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Thijs, Steven
;
Linten, Dimitri
;
Scholz, Mirko
;
Mercha, Abdelkarim
;
Van der Plas, Geert
;
Travaly, Youssef
;
Van Olmen, Jan
;
Groeseneken, Guido
Journal
Abstract
Description
Metrics
Views
1919
since deposited on 2021-10-18
3
last month
Acq. date: 2025-12-16
Citations
Metrics
Views
1919
since deposited on 2021-10-18
3
last month
Acq. date: 2025-12-16
Citations