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ESD evaluation of 3D SIC technology using TSV

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dc.contributor.authorThijs, Steven
dc.contributor.authorLinten, Dimitri
dc.contributor.authorScholz, Mirko
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorTravaly, Youssef
dc.contributor.authorVan Olmen, Jan
dc.contributor.authorGroeseneken, Guido
dc.contributor.imecauthorThijs, Steven
dc.contributor.imecauthorLinten, Dimitri
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.orcidimecThijs, Steven::0000-0003-2889-8345
dc.contributor.orcidimecLinten, Dimitri::0000-0001-8434-1838
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.date.accessioned2021-10-18T22:18:07Z
dc.date.available2021-10-18T22:18:07Z
dc.date.embargo9999-12-31
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18081
dc.source.conferenceInternational ESD Workshop - IEW
dc.source.conferencedate10/05/2010
dc.source.conferencelocationTutzing Germany
dc.title

ESD evaluation of 3D SIC technology using TSV

dc.typeOral presentation
dspace.entity.typePublication
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