Publication:

Comparison between wet and dry silicon via reveal in 3D backside processing

Date

2015
Proceedings Paper
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dc.contributor.authorThomas, Dave
dc.contributor.authorHopkins, Janet
dc.contributor.authorAshraf, Huma
dc.contributor.authorPatel, Jash
dc.contributor.authorAnsell, Oliver
dc.contributor.authorJourdain, Anne
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T23:32:25Z
dc.date.available2021-10-22T23:32:25Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25992
dc.source.conference12th Annual International Wafer Level Packaging Workshop - IWLPC
dc.source.conferencedate13/10/2015
dc.source.conferencelocationSan Jose, CA USA
dc.title

Comparison between wet and dry silicon via reveal in 3D backside processing

dc.typeProceedings paper
dspace.entity.typePublication
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