Publication:
A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects
Loading...
Journal
Abstract
Description
Statistics
Downloads
202 since deposited on 2024-12-06
23last month
4last week
Acq. date: 2026-02-25
Views
156 since deposited on 2024-12-06
Acq. date: 2026-02-25
Citations
Statistics
Downloads
202 since deposited on 2024-12-06
23last month
4last week
Acq. date: 2026-02-25
Views
156 since deposited on 2024-12-06
Acq. date: 2026-02-25
Citations