Publication:

A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects

Date

2024
Journal article
https://doi.org/10.3390/nano14221834
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dc.contributor.authorSaleh, Ahmed
dc.contributor.authorCroes, Kristof
dc.contributor.authorCeric, Hajdin
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorZahedmanesh, Houman
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorSaleh, Ahmed
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecZahedmanesh, Houman::0000-0002-0290-691X
dc.contributor.orcidimecSaleh, Ahmed::0000-0002-2663-1922
dc.date.accessioned2025-06-11T13:49:37Z
dc.date.available2024-12-06T16:46:02Z
dc.date.available2025-06-11T13:49:37Z
dc.date.embargo2024-11-16
dc.date.issued2024
dc.identifier.doi10.3390/nano14221834
dc.identifier.issn2079-4991
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44929
dc.publisherMDPI
dc.source.beginpageArt. 1834
dc.source.endpageN/A
dc.source.issue22
dc.source.journalNANOMATERIALS
dc.source.numberofpages15
dc.source.volume14
dc.subject.keywordsVOID NUCLEATION
dc.subject.keywordsGRAIN-SIZE
dc.subject.keywordsSTRESS
dc.subject.keywordsINTERFACES
dc.subject.keywordsSIMULATION
dc.subject.keywordsMIGRATION
dc.subject.keywordsEVOLUTION
dc.subject.keywordsLINES
dc.title

A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects

dc.typeJournal article
dspace.entity.typePublication
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