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Exploring Bonding Mechanism of SiCN for Hybrid Bonding
Publication:
Exploring Bonding Mechanism of SiCN for Hybrid Bonding
Date
2024
Proceedings Paper
https://doi.org/10.1109/ECTC51529.2024.00331
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ebiko, Sodai
;
Iacovo, Serena
;
Chew, Soon Aik
;
Zhang, Boyao
;
Uedono, Akira
;
Inoue, Fumihiro
Journal
N/A
Abstract
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88
since deposited on 2024-12-07
Acq. date: 2025-10-23
Citations
Metrics
Views
88
since deposited on 2024-12-07
Acq. date: 2025-10-23
Citations