Publication:
Exploring Bonding Mechanism of SiCN for Hybrid Bonding
| dc.contributor.author | Ebiko, Sodai | |
| dc.contributor.author | Iacovo, Serena | |
| dc.contributor.author | Chew, Soon Aik | |
| dc.contributor.author | Zhang, Boyao | |
| dc.contributor.author | Uedono, Akira | |
| dc.contributor.author | Inoue, Fumihiro | |
| dc.contributor.imecauthor | Iacovo, Serena | |
| dc.contributor.imecauthor | Zhang, Boyao | |
| dc.contributor.imecauthor | Chew, Soon Aik | |
| dc.contributor.orcidimec | Iacovo, Serena::0000-0002-0826-9165 | |
| dc.contributor.orcidimec | Zhang, Boyao::0000-0002-7976-0146 | |
| dc.contributor.orcidimec | Chew, Soon Aik::0000-0003-3013-4846 | |
| dc.date.accessioned | 2025-08-05T07:46:27Z | |
| dc.date.available | 2024-12-07T16:57:34Z | |
| dc.date.available | 2025-08-05T07:46:27Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/ECTC51529.2024.00331 | |
| dc.identifier.eisbn | 979-8-3503-7598-5 | |
| dc.identifier.isbn | 979-8-3503-7599-2 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/44950 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 1953 | |
| dc.source.conference | IEEE 74th Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | MAY 28-31, 2024 | |
| dc.source.conferencelocation | Denver | |
| dc.source.endpage | 1957 | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 5 | |
| dc.title | Exploring Bonding Mechanism of SiCN for Hybrid Bonding | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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