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Stress in electrochemically deposited copper
Publication:
Stress in electrochemically deposited copper
Date
1999
Proceedings Paper
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3241.pdf
317.07 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Brongersma, Sywert
;
Richard, Emmanuel
;
Vervoort, Iwan
;
Maex, Karen
Journal
Abstract
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1944
since deposited on 2021-10-06
Acq. date: 2025-10-23
Citations
Metrics
Views
1944
since deposited on 2021-10-06
Acq. date: 2025-10-23
Citations