Publication:

Stress in electrochemically deposited copper

Date

1999
Proceedings Paper
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dc.contributor.authorBrongersma, Sywert
dc.contributor.authorRichard, Emmanuel
dc.contributor.authorVervoort, Iwan
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.date.accessioned2021-10-06T10:46:18Z
dc.date.available2021-10-06T10:46:18Z
dc.date.embargo9999-12-31
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3279
dc.source.beginpage249
dc.source.conferenceStress Induced Phenomena in Metallization: 5th International Workshop
dc.source.conferencedate23/06/1999
dc.source.conferencelocationStuttgart Germany
dc.source.endpage254
dc.title

Stress in electrochemically deposited copper

dc.typeProceedings paper
dspace.entity.typePublication
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