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Synchrotron measurement of the effect of dielectric porosity and air gaps on the stress in advanced Cu/low-k interconnects

Date

2009
Proceedings Paper
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dc.contributor.authorWilson, Chris
dc.contributor.authorZhao, Chao
dc.contributor.authorZhao, Larry
dc.contributor.authorTokei, Zsolt
dc.contributor.authorCroes, Kristof
dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorBeyer, Gerald
dc.contributor.authorHorsfall, A
dc.contributor.authorO'Neill, A
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-18T05:20:50Z
dc.date.available2021-10-18T05:20:50Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16550
dc.source.beginpage72
dc.source.conferenceIEEE Internationa Interconnect Technology Conference - IITC
dc.source.conferencedate1/06/2009
dc.source.conferencelocationSapporo, Hokkaido Japan
dc.source.endpage74
dc.title

Synchrotron measurement of the effect of dielectric porosity and air gaps on the stress in advanced Cu/low-k interconnects

dc.typeProceedings paper
dspace.entity.typePublication
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