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Study of the effect of dielectric porosity on the stress in advanced Cu/low-k interconnects using x-ray diffraction
Publication:
Study of the effect of dielectric porosity on the stress in advanced Cu/low-k interconnects using x-ray diffraction
Date
2009
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Wilson, Chris
;
Zhao, Chao
;
Zhao, Larry
;
Metzger, T.H.
;
Tokei, Zsolt
;
Croes, Kristof
;
Pantouvaki, Marianna
;
Beyer, Gerald
;
Horsfall, A.B.
;
O Neill, A.G.
Journal
Applied Physics Letters
Abstract
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1965
since deposited on 2021-10-18
Acq. date: 2025-10-26
Citations
Metrics
Views
1965
since deposited on 2021-10-18
Acq. date: 2025-10-26
Citations