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Study of the effect of dielectric porosity on the stress in advanced Cu/low-k interconnects using x-ray diffraction

Date

2009
Journal article
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dc.contributor.authorWilson, Chris
dc.contributor.authorZhao, Chao
dc.contributor.authorZhao, Larry
dc.contributor.authorMetzger, T.H.
dc.contributor.authorTokei, Zsolt
dc.contributor.authorCroes, Kristof
dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorBeyer, Gerald
dc.contributor.authorHorsfall, A.B.
dc.contributor.authorO Neill, A.G.
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-18T05:20:22Z
dc.date.available2021-10-18T05:20:22Z
dc.date.issued2009
dc.identifier.issn0003-6951
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16549
dc.source.beginpage181914
dc.source.issue18
dc.source.journalApplied Physics Letters
dc.source.volume94
dc.title

Study of the effect of dielectric porosity on the stress in advanced Cu/low-k interconnects using x-ray diffraction

dc.typeJournal article
dspace.entity.typePublication
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