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Microstrip thin-film MCM-D technology as enabling platform for the integration of high-performance SiP modules
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Microstrip thin-film MCM-D technology as enabling platform for the integration of high-performance SiP modules
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Date
2007-11
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Posada Quijano, Guillermo
;
Carchon, Geert
;
Soussan, Philippe
;
Pham, Nga
;
Majeed, Bivragh
;
Sabuncuoglu Tezcan, Deniz
;
Ruythooren, Wouter
;
Nauwelaers, Bart
;
De Raedt, Walter
;
Beyne, Eric
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Views
1891
since deposited on 2021-10-16
1
last month
Acq. date: 2025-12-16
Citations