Publication:

Microstrip thin-film MCM-D technology as enabling platform for the integration of high-performance SiP modules

Date

2007-11
Meeting abstract
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dc.contributor.authorPosada Quijano, Guillermo
dc.contributor.authorCarchon, Geert
dc.contributor.authorSoussan, Philippe
dc.contributor.authorPham, Nga
dc.contributor.authorMajeed, Bivragh
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorNauwelaers, Bart
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorPham, Nga
dc.contributor.imecauthorMajeed, Bivragh
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-16T18:47:13Z
dc.date.available2021-10-16T18:47:13Z
dc.date.issued2007-11
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12734
dc.source.conferenceIMAPS Advanced Technology Workshop on Integrated/Embedded Passives
dc.source.conferencedate15/11/2007
dc.source.conferencelocationSan Jose, CA USA
dc.title

Microstrip thin-film MCM-D technology as enabling platform for the integration of high-performance SiP modules

dc.typeMeeting abstract
dspace.entity.typePublication
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