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Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV
Publication:
Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV
Date
2010
Journal article
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Okoro, Chukwudi
;
Vanstreels, Kris
;
Labie, Riet
;
Luhn, Ole
;
Vandevelde, Bart
;
Verlinden, Bert
;
Vandepitte, Dirk
Journal
Journal of Micromechanics and Microengineering
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1922
since deposited on 2021-10-18
Acq. date: 2025-10-23
Citations
Metrics
Views
1922
since deposited on 2021-10-18
Acq. date: 2025-10-23
Citations