Publication:
Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV
Date
| dc.contributor.author | Okoro, Chukwudi | |
| dc.contributor.author | Vanstreels, Kris | |
| dc.contributor.author | Labie, Riet | |
| dc.contributor.author | Luhn, Ole | |
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Verlinden, Bert | |
| dc.contributor.author | Vandepitte, Dirk | |
| dc.contributor.imecauthor | Vanstreels, Kris | |
| dc.contributor.imecauthor | Labie, Riet | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.orcidimec | Vanstreels, Kris::0000-0002-4420-0966 | |
| dc.contributor.orcidimec | Labie, Riet::0000-0002-1401-1291 | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.date.accessioned | 2021-10-18T19:48:47Z | |
| dc.date.available | 2021-10-18T19:48:47Z | |
| dc.date.issued | 2010 | |
| dc.identifier.issn | 0960-1317 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/17730 | |
| dc.source.beginpage | 45032 | |
| dc.source.issue | 4 | |
| dc.source.journal | Journal of Micromechanics and Microengineering | |
| dc.source.volume | 20 | |
| dc.title | Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
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