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Creating 1 $lm RDL structures for fan-out wafer-level packaging
Publication:
Creating 1 $lm RDL structures for fan-out wafer-level packaging
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Date
2018
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38877.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Flack, Warren
;
Slabbekoorn, John
Journal
Chip Scale Review
Abstract
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1957
since deposited on 2021-10-25
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Acq. date: 2025-12-12
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Metrics
Views
1957
since deposited on 2021-10-25
3
last month
Acq. date: 2025-12-12
Citations