Publication:
Creating 1 $lm RDL structures for fan-out wafer-level packaging
Date
| dc.contributor.author | Flack, Warren | |
| dc.contributor.author | Slabbekoorn, John | |
| dc.contributor.imecauthor | Slabbekoorn, John | |
| dc.date.accessioned | 2021-10-25T18:39:59Z | |
| dc.date.available | 2021-10-25T18:39:59Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2018 | |
| dc.identifier.issn | 1526-1344 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/30710 | |
| dc.identifier.url | http://www.chipscalereview.com/issue2018.html | |
| dc.source.beginpage | 7 | |
| dc.source.endpage | 10 | |
| dc.source.issue | 3 | |
| dc.source.journal | Chip Scale Review | |
| dc.source.volume | 22 | |
| dc.title | Creating 1 $lm RDL structures for fan-out wafer-level packaging | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | Original bundle
| |
| Publication available in collections: |