Publication:

Multi-wire interconnection: The impact of the lamination process and the encapsulant properties on the solder joint formation

Date

2018

Proceedings Paper

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Author(s)

;

;

Govaerts, Jonathan

;

Nivelle, Philippe

;

van der Heide, Arvid

;

;

Voroshazi, Eszter

;

Szlufcik, Jozef

;

Van Vuure, A.W.

;

Statistics

1991 since deposited on 2021-10-26

Acq. date: 2026-02-25