Publication:

Multi-wire interconnection: The impact of the lamination process and the encapsulant properties on the solder joint formation

Date

2018
Proceedings Paper
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dc.contributor.authorVan Dyck, Rik
dc.contributor.authorBorgers, Tom
dc.contributor.authorGovaerts, Jonathan
dc.contributor.authorNivelle, Philippe
dc.contributor.authorvan der Heide, Arvid
dc.contributor.authorDe Jonge, S.
dc.contributor.authorVoroshazi, Eszter
dc.contributor.authorSzlufcik, Jozef
dc.contributor.authorVan Vuure, A.W.
dc.contributor.authorPoortmans, Jef
dc.contributor.imecauthorVan Dyck, Rik
dc.contributor.imecauthorBorgers, Tom
dc.contributor.imecauthorGovaerts, Jonathan
dc.contributor.imecauthorNivelle, Philippe
dc.contributor.imecauthorvan der Heide, Arvid
dc.contributor.imecauthorVoroshazi, Eszter
dc.contributor.imecauthorSzlufcik, Jozef
dc.contributor.imecauthorPoortmans, Jef
dc.contributor.orcidimecVan Dyck, Rik::0000-0003-3947-4361
dc.contributor.orcidimecBorgers, Tom::0000-0002-7878-6977
dc.contributor.orcidimecGovaerts, Jonathan::0000-0002-8908-1198
dc.contributor.orcidimecvan der Heide, Arvid::0000-0002-7589-4526
dc.contributor.orcidimecPoortmans, Jef::0000-0003-2077-2545
dc.date.accessioned2021-10-26T06:48:39Z
dc.date.available2021-10-26T06:48:39Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32047
dc.identifier.urlhttps://www.eupvsec-proceedings.com/proceedings?fulltext=imec&paper=45015
dc.source.beginpage1328
dc.source.conference35th European Photovoltaic Solar Energy Conference and Exhibition - EUPVSEC
dc.source.conferencedate24/09/2018
dc.source.conferencelocationBrussels Belgium
dc.source.endpage1332
dc.title

Multi-wire interconnection: The impact of the lamination process and the encapsulant properties on the solder joint formation

dc.typeProceedings paper
dspace.entity.typePublication
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