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Process optimization and integration of trimethylsilane-deposited a-SiC:H and a-SiCO:H dielectric thin films for damascene processing
Publication:
Process optimization and integration of trimethylsilane-deposited a-SiC:H and a-SiCO:H dielectric thin films for damascene processing
Date
2003
Journal article
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Gray, W.D.
;
Loboda, M.J.
;
Bremmer, J.N.
;
Struyf, Herbert
;
Lepage, Muriel
;
Van Hove, Marleen
;
Alves Donaton, Ricardo
;
Sleeckx, Erik
;
Stucchi, Michele
;
Lanckmans, Filip
;
Gao, Teng
;
Boullart, Werner
;
Coenegrachts, Bart
;
Maenhoudt, Mireille
;
Vanhaelemeersch, Serge
;
Meynen, H.
;
Maex, Karen
Journal
Journal of the Electrochemical Society
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1947
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations
Metrics
Views
1947
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations