Publication:

Process optimization and integration of trimethylsilane-deposited a-SiC:H and a-SiCO:H dielectric thin films for damascene processing

Date

2003
Journal article
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dc.contributor.authorGray, W.D.
dc.contributor.authorLoboda, M.J.
dc.contributor.authorBremmer, J.N.
dc.contributor.authorStruyf, Herbert
dc.contributor.authorLepage, Muriel
dc.contributor.authorVan Hove, Marleen
dc.contributor.authorAlves Donaton, Ricardo
dc.contributor.authorSleeckx, Erik
dc.contributor.authorStucchi, Michele
dc.contributor.authorLanckmans, Filip
dc.contributor.authorGao, Teng
dc.contributor.authorBoullart, Werner
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorMaenhoudt, Mireille
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorMeynen, H.
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorBoullart, Werner
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.accessioned2021-10-15T04:50:30Z
dc.date.available2021-10-15T04:50:30Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7628
dc.source.beginpageG404
dc.source.endpageG411
dc.source.issue7
dc.source.journalJournal of the Electrochemical Society
dc.source.volume150
dc.title

Process optimization and integration of trimethylsilane-deposited a-SiC:H and a-SiCO:H dielectric thin films for damascene processing

dc.typeJournal article
dspace.entity.typePublication
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