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Acoustic and photoacoustic inspection of through-silicon-vias in the GHz-frequency band
Publication:
Acoustic and photoacoustic inspection of through-silicon-vias in the GHz-frequency band
Date
2017
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Brand, Sebastian
;
Kogel, Michael
;
Altmann, Frank
;
De Wolf, Ingrid
;
Khaled, Ahmad
;
Moore, Michael J.
;
Strohm, Eric M.
;
Kolios, Michael C.
;
Strohm, Eric. M.
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1881
since deposited on 2021-10-24
Acq. date: 2025-10-27
Citations
Metrics
Views
1881
since deposited on 2021-10-24
Acq. date: 2025-10-27
Citations