Publication:

Acoustic and photoacoustic inspection of through-silicon-vias in the GHz-frequency band

Date

2017
Proceedings Paper
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dc.contributor.authorBrand, Sebastian
dc.contributor.authorKogel, Michael
dc.contributor.authorAltmann, Frank
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorKhaled, Ahmad
dc.contributor.authorMoore, Michael J.
dc.contributor.authorStrohm, Eric M.
dc.contributor.authorKolios, Michael C.
dc.contributor.authorStrohm, Eric. M.
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorKhaled, Ahmad
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecKhaled, Ahmad::0000-0003-2892-3176
dc.date.accessioned2021-10-24T03:09:47Z
dc.date.available2021-10-24T03:09:47Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27927
dc.source.conference43rd Intenational Symposium for Testing and Failure Analysis - ISTFA
dc.source.conferencedate5/11/2017
dc.source.conferencelocationPasadena, CA USA
dc.title

Acoustic and photoacoustic inspection of through-silicon-vias in the GHz-frequency band

dc.typeProceedings paper
dspace.entity.typePublication
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