Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Articles
Solid state diffusion of Cu-Sn and Ni-Sn diffusion couples with-flip chip scale dimensions
Publication:
Solid state diffusion of Cu-Sn and Ni-Sn diffusion couples with-flip chip scale dimensions
Copy permalink
Date
2007
Journal article
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Labie, Riet
;
Ruythooren, Wouter
;
Van Humbeeck, Jan
Journal
Intermetallics
Abstract
Description
Metrics
Views
1868
since deposited on 2021-10-16
1
last month
1
last week
Acq. date: 2026-01-08
Citations
Metrics
Views
1868
since deposited on 2021-10-16
1
last month
1
last week
Acq. date: 2026-01-08
Citations