Publication:
Solid state diffusion of Cu-Sn and Ni-Sn diffusion couples with-flip chip scale dimensions
Date
| dc.contributor.author | Labie, Riet | |
| dc.contributor.author | Ruythooren, Wouter | |
| dc.contributor.author | Van Humbeeck, Jan | |
| dc.contributor.imecauthor | Labie, Riet | |
| dc.contributor.imecauthor | Ruythooren, Wouter | |
| dc.contributor.orcidimec | Labie, Riet::0000-0002-1401-1291 | |
| dc.date.accessioned | 2021-10-16T17:14:06Z | |
| dc.date.available | 2021-10-16T17:14:06Z | |
| dc.date.issued | 2007 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/12426 | |
| dc.source.beginpage | 396 | |
| dc.source.endpage | 403 | |
| dc.source.issue | 3 | |
| dc.source.journal | Intermetallics | |
| dc.source.volume | 15 | |
| dc.title | Solid state diffusion of Cu-Sn and Ni-Sn diffusion couples with-flip chip scale dimensions | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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